CONCLUSION In this study, fatigue reliability of halogen free substrate noticed as an environmental harmony type printed circuit board backing was evaluated. And, the examination was demonstratively carried out on the difference of fracture mechanism in fatigue fracture and static fracture from mesoscopic viewpoint. Main results were as follows; (1) Fatigue life of halogen free material was longer than that of halogen material, though mechanical property of both materials was same. (2) Fatigue crack of halogen-free material has comparatively been generated at the initial stage in fatigue life. In the meantime, halogen material was immediately broken , after the crack was generated, and the fracture morphology was brittle. (3) From the fractographic study, it was indicated that size of the characteristic destruction pattern; Unit Fracture Area influenced the difference of fatigue life between halogen free material and halogen material. (4) The difference of fatigue life between halogen material and halogen free material was explained in weakest link model in fatigue fracture. That is to say, the resin or the interface between fiber and resin is a weakest link in fatigue fracture. In the meantime, the effect of difference of resin didn’t appear in the difference of static strength between halogen material and halogen free material, because the reinforcement glass fiber undertook the material strength in static fracture. REFERENCE (1) H.Suzuki, Fatigue reliability evaluation of the electronic component, (1997) (2) T.Takahama,O.Hayashi,Journal of Japan adhesion institute,Vol.27,No.4(1991) (3) “From the circuit to the mounting”,Ccompiled by Japan Circuit Mounting Institute,pp15-23 (4) J.Sasaki,K.Hatakeda, High-density packaging technology symposium, Japan Circuit Mounting Institute,1-6,30-35 (5) S,Mizumoto,J.of JIEP,The 6th workshop proceeding,(1998),pp25-29 (7) K.Suga,H.hayashi, J.of JIEP,Vol.3, No.1(2000),pp22-23 (8) K.Yoshiki, “The plastic of the electronics field” Magazine plastic, separate volume, Japan industry investigating committee,(1997),49-54 (9) H.Suzuki，M.Nakamura，T.Kiyotomo，M.Kouhara，T.Haraguchi,Trans.JSME，60-580,A(1996) pp.2695-2701 (10) M.Nakamura，T.Haraguchi，H.Suzuki,Trans.JSME，62-600,A(1996) pp.1773-1778 (11) H.Suzuki, H.Fukunaga, A.Matsumura, T.Haraguchi, Trans.JSME, 62-596,A(1996), pp966-971 (12) H.Suzuki,A.Matsumura,H.Fukunaga,T.Haraguchi, Trans.JSME,62-603,A(1996) , pp689-694 (13) H.Suzuki,T.Haraguchi,M.Nakamura and S.Nishino Proceeding of International Workshopon Polymer Blends & Polymer Composites (1997), pp.128-135 (14)M.Nakamura，H.Suzuki，T.Haraguchi，Y.Watanabe,Trans.JSME,63-606,A(1997), pp.213-219, (15) H.Fukunaga, A.Matsumura, K.yu, H.Suzuki, Trans.JSME, 63-608,A (1997), pp2501-2505 (16) H.Fukunaga, H.Suzuki, A.Matsumura, Trans.JSME, 63-613, A (1997), pp1874-1879, (17) H.Fukunaga, H.Suzuki, A.Matsumura, T.Haraguchi, Trans.JSME, 63-613,A (1997), pp1880-1885, (18) H.Suzuki，T.Haraguchi，M.Nakamura，Y.Okuno，Trans.JSME，64-619，pp.590-596，A(1998) (19) H.Suzuki，M.Nakamura，Y.Watanabe，T.Haraguchi，Y.Okuno,Trans.JSME，64- 621,A(1998),pp.1244-1250 (20) S.Wang，Y.Okuno，M.Nakamura，H.Suzuki，T.Haraguchi，Trans.JSME，65-637，A(1999), pp.1928-1934, (21)K.Takano, T.Hukuda, M.Oze, Y.Murai, MES’99, Proceedings of the 9th microelectronics symposium, pp229-232 (22) K.Ohori,M.Yano,T.Aizawa,M.Kakiya, Technical report of Hitachi Chemical Co.,Ltd.. , No.33 (1999-7), pp27-30 (23) N.Honda, J.of JIEP, Vol.3, No.1 (2000),pp74-77 (24) T.Yasuda, Plastics, Vol.50, No.7 (1999), pp18-29 (25) A.Happoya,J.of JIEP, Vol.2,No.6(1999),pp481-484 (26) S.Honda, J.of JIEP, Vol.1, No.4 (1998), pp257-258 (27) R.Koterazawa, Zairyo, Need theory of material strength science, Asakura syoten (in Japanese), pp96-98
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